Samsung Electronics has unveiled its next-generation AI semiconductor innovations, including the advanced HBM4E memory, as it deepens collaboration with NVIDIA at the NVIDIA GTC 2026 in San Jose, California.
The announcement signals Samsung’s ambition to lead in AI infrastructure by delivering end-to-end semiconductor solutions spanning memory, logic, foundry, and advanced packaging.
Breakthrough HBM4 and HBM4E Take Center Stage
At the core of Samsung’s showcase is its sixth-generation HBM4, now in mass production and optimized for NVIDIA’s next-generation AI platform. The memory delivers speeds of up to 11.7Gbps, surpassing the current industry benchmark, with potential scaling to 13Gbps.
Samsung also introduced its successor, HBM4E, for the first time. The new chip pushes performance further with 16Gbps per pin and bandwidth reaching 4.0 terabytes per second, targeting the growing demands of high-performance AI workloads in modern data centers.
The company is also advancing chip design through hybrid copper bonding technology, enabling higher stacking capacity while reducing heat resistance by over 20 percent.
Strengthening Strategic Alliance with NVIDIA
Samsung highlighted its deepening partnership with NVIDIA through a dedicated showcase of integrated AI infrastructure solutions.
Key technologies on display include SOCAMM2 memory modules and high-performance SSDs such as the PM1763 and PM1753, designed to support NVIDIA’s accelerated computing platforms. These solutions are aimed at improving scalability, energy efficiency, and processing speed in AI data centers.
The collaboration also extends to storage innovations under NVIDIA’s BlueField-4 architecture, reinforcing performance for AI inference workloads.
Powering AI Factories and Digital Twin Manufacturing
Beyond hardware, Samsung is leveraging its partnership with NVIDIA to transform semiconductor manufacturing through AI-powered “AI Factories.”
Using accelerated computing and NVIDIA Omniverse technologies, the company is scaling digital twin capabilities to optimize chip design, engineering, and production processes. This approach enables real-time simulation and enhanced efficiency across manufacturing operations.
A keynote session at the conference is set to further explore how agentic AI is reshaping semiconductor production, from electronic design automation to advanced fabrication systems.
Advancing On-Device AI and Edge Computing
Samsung is also targeting the growing demand for on-device AI with new memory and storage solutions tailored for personal computing and mobile devices.
Its LPDDR5X and next-generation LPDDR6 DRAM modules offer faster data speeds, lower latency, and improved power efficiency. LPDDR5X achieves up to 25Gbps while reducing power consumption, while LPDDR6 is expected to reach up to 35Gbps with enhanced power management features.
The company is also showcasing NAND solutions such as PM9E3 and PM9E1, designed to support high-performance personal AI systems, including NVIDIA’s DGX platforms.
Driving the Future of AI Infrastructure
With its comprehensive portfolio and deepening ecosystem partnerships, Samsung is positioning itself at the forefront of the AI revolution. The company’s latest innovations underscore a broader industry shift toward integrated, high-performance, and energy-efficient computing solutions that can power the next generation of AI applications, from hyperscale data centers to edge devices.